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FLASH GOLD NC
- Neutral type electroless gold plating solution
  Sulfite based, cyanide free product
  High deposition performance on high P content electroless nickel plating films
  High deposition performance on palladium plating films
- Electroless Ni-P/Au Plating Process
  
  Electroless Gold Plating Solution
- Printed Wiring Board, Copper alloy, Low temperature co-fired ceramics(LTCC)
FLASH GOLD 505
- Immersion gold plating solution
  Use with potassium dicyanoaurate (I)
  Low gold concentration (0.5 g/L)
- Electroless Ni-P/Au Plating Process
  
  Electroless Gold Plating Solution
- Printed Wiring Board, Nickel
ICP ACCERA AP-TM
- Excellent in fine pattern forming performance
  High selectivity to Cu patterns
  Less copper corrosion, a long bath life
- Catalyzing Agent
- Printed Wiring Board
ICP NICORON FPF-TM
- High folding endurance
  Deposition rate 12μm/h (P content: 7 to 11% by weight)
  Prevent blackening and corrosion after stripping immersion gold plating
  Excellent in solder wet and solder joint performance
  Fine pattern and semi-bright appearance can be obtained
- Electroless Ni-P/Au Plating Process
  
  Electroless Nickel Plating Solution
- Printed Wiring Board
ICP ACCERA COA
- Reducing type catalyzing solution
  Prevent copper circuit corrosion
  Prevent voids
  Selectively activate copper circuit pattern
  Excellent in fine pattern forming performance
- Electroless Ni-P/Au Plating Process
  
  Activator
- Printed Wiring Board
FLASH GOLD 330S
- High solder wettability, solder joint strength
  Reduce damage to base nickel films
  Fine and uniform deposition
  Deposition rate: 0.085μm/10min (at 84℃)
- Electroless Ni-P/Au Plating Process
  
  Electroless Gold Plating Solution
- Printed Wiring Board
ICP CLEAN T-2
- Low-foaming, foams can be broken easily
  Suitable for spray machine
  Strongly remove dirt and resist residues
  Low surface tension, high permeability
- Electroless Ni-P/Au Plating Process
  
  Alkaline Cleaner
- Printed Wiring Board
ICP ACCERA AP
- Excellent in fine pattern formation performance
  High selectivity to copper patterns
  Prevent copper dissolution, a long bath life
- Electroless Ni-P/Au Plating Process
  
  Activator
- Printed Wiring Board
OPC HOLE PROTECTOR
- Acidic treatment agent to prevent deposition of electroless nickel plating into non-conductive holes in PWB
  Prevent electroless nickel deposition out of patterns
- Electroless Ni-P/Au Plating Process
  
  Catalyst Masking Agent
- Printed Wiring Board
FLASH GOLD 330
- Reduce damage to nickel films
  Fine and uniform film appearance can be obtained
  High solder wettability and solder joint strength
  Can use at a low temperature (0.06μm/10min at 80℃)
- Electroless Ni-P/Au Plating Process
  
  Electroless Gold Plating Solution
- Printed Wiring Board
ICP POSTDIP T-1
- Use as pretreatment for isolated circuit patterns
  Use after accelerating step
  Prevent electroless nickel deposition out of patterns
  Excellent in fine pattern formation performance
- Electroless Ni-P/Au Plating Process
  
  Post-dipping Agent
- Printed Wiring Board
ICP POSTDIP RP
- For pretreatment to isolated circuit patterns
  Use after Pd acceleration to remove palladium from surfaces
  High selectivity only to copper electrodes
  Excellent in fine pattern formation performance
- Electroless Ni-P/Au Plating Process
  
  Post-dipping Agent
- Printed Wiring Board
ICP NICORON SOF(NP)
- Electroless Ni-P plating solution for isolated circuit patterns
  High-P content
  High corrosion resistance
  High tolerance to sulfurous acid gas
- Electroless Ni-P/Au Plating Process
  
  Electroless Nickel Plating Solution
- Printed Wiring Board
ICP NICORON SOF
- Electroless Ni-P plating solution for isolated circuit patterns
  High-P content, high corrosion resistance
  High tolerance to sulfurous acid gas
- Electroless Ni-P/Au Plating Process
  
  Electroless Nickel Plating Solution
- Printed Wiring Board
ICP NICORON HFP
- Electroless Ni-P plating solution
  Great corrosion resistance
  For fine pattern formation
  (P content: 11% by weight)
- Electroless Ni-P/Au Plating Process
  
  Electroless Nickel Plating Solution
- Printed Wiring Board
ICP NICORON GME(NP)
- Electroless Ni-P plating on ceramic boards
  Lead-free product
  (P content: 7% by weight)
- Electroless Ni-P/Au Plating Process
  
  Electroless Nickel Plating Solution
- Printed Wiring Board
ICP NICORON GM-SE
- Electroless Ni-P plating solution
  High corrosion resistance, high solder wettability
  (P content: 9% by weight)
- Electroless Ni-P/Au Plating Process
  
  Electroless Nickel Plating Solution
- Printed Wiring Board
ICP NICORON FPF
- Electroless Ni-P plating solution
  Have strong folding endurance
  Best for FPC substrates
  (P content: 7% by weight)
- Electroless Ni-P/Au Plating Process
  
  Electroless Nickel Plating Solution
- Printed Wiring Board
ICP CLEAN S-135K
- Acidic type product, have strong cleaning power
  Great peameability
- Electroless Ni-P/Au Plating Process
  
  Acidic Cleaner
- Printed Wiring Board
ICP CLEAN 310
- Acidic cleaner for isolated circuit pattern
  Conduct micro-etching on copper surface
  Strongly clean copper surface for fine pattern forming
- Electroless Ni-P/Au Plating Process
  
  Acidic Cleaner
- Printed Wiring Board
ICP ACCERA
- Show great selectivity
  Work as activator
- Electroless Ni-P/Au Plating Process
  
  Activator
- Printed Wiring Board
SELF GOLD OTK-IT
- Reducing type electroless gold plating solution
  Neutral-type product
  Cyanide-free product
  Excellent in wire bonding performance
- Electroless Ni-P/Au Plating Process
  
  Electroless Gold Plating Solution
- Printed Wiring Board
OPC MUDENGOLD 25
- Electroless gold plating solution
  Alkaline-, reduction-type
  Deposition rate 5μm/h, excellent in gold-wire bonding performance
- Electroless Ni-P/Au Plating Process
  
  Electroless Gold Plating Solution
- Ceramics