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  • TOP_DuNC_CU
  • Decorative Plating
  • Cu/Ni/Cr Plating
  • Copper Plating
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  • TOP DuNC CU(G type)

    • Excellent in brightness, leveling, film properties
      High quality films come available
      Realize high leveling performance with high sulfuric-acid concentration bath
      Can use for high sulfuric-acid concentration bath
      High macrothrowing power can be realized
    • Acid Copper Plating
    • ABS, PC/ABS, Nonconductor, General metal

  • TOP DuNC CU(WF type)

    • Excellent in brightness, leveling, film properties
      High quality films come available
      Realize high leveling performance with high sulfuric-acid concentration bath
      Can use for high sulfuric-acid concentration bath
      High macro-throwing power can be realized
    • Acid Copper Plating
    • ABS, PC/ABS, Nonconductor, General metal

  • TOP DuNC CU-H

    • Pit inhibitor for acid copper plating bath
      Uniform and high-corrosion resistant films can be obtained
      Semi-bright appeatance can be obtained
    • Acid Copper Plating
    • ABS, PC/ABS, Nonconductor, General metal

  • TOP DuNC CU(X type)

    • Can reduce pits
      High quality films can be easily obtained
      High-grade physical properties including malleability
      Less sludge, easy bath maintenance
      Excellent leveling ability comes available at wide range of current density
    • Acid Copper Plating
    • ABS, PC/ABS, General metal, Nonconductor

  • TOP DuNC CU(S type)

    • ECan reduce pits
      High quality films can be easily obtained
      High-grade physical properties including malleability
      Less sludge, easy bath maintenance
      Excellent leveling ability comes available at wide range of current density
    • Acid Copper Plating
    • ABS, PC/ABS, General metal, Nonconductor