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  • OPC H-TEC
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  • OPC H-TEC NEUTRALIZER

    • Improve covering performance into through and via holes
      Excellent in penetration power into small holes
      Suitable for horizontal conveyance plating system
      (Batch treatment is possible)
    • Neutralizer
    • Printed Wiring Board
  • OPC H-TEC CATALYST LC

    • Reduce time for roller maintenance from acid-type catalyst process
      Excellent permeability into small holes
      Can shorten treatment time
      Strong adsorbing power of catalysts to PWBs
      Reduce Pd concentration at the time of initial make-up to 50%
    • Catalyzing Agent
    • Printed Wiring Board
  • OPC H-TEC CONDICLEAN WA-1

    • Promote catalyst adsorption on hole wall, resin, glass fiber
      Can omit anionic pre-dipping step
      High connection reliability with inner copper foils
      Prevent foaming by agitation or bath circulation
    • Conditioner
    • Printed Wiring Board
  • OPC H-TEC REDUCER

    • Increase deposition and adhesion performance of electroless copper plating
      Can add boric acid separately
      Metallize palladium ions
    • Accelerator
    • Printed Wiring Board
  • OPC H-TEC PREDIP HP

    • Use for pre-dipping before alkaline-type catalyst bathes
      Very low foaming product
      Strongly reduce impact to catalyst bathes
    • Pre-dipping Agent
    • Printed Wiring Board
  • OPC H-TEC PREDIP

    • Use for pre-dipping before alkaline-type catalyst bathes
      Low foaming
      Increase catalyst adsorption performance
    • Pre-dipping Agent
    • Printed Wiring Board
  • OPC H-TEC PRECONDITION

    • Use for surface conditioning
      Strong alkaline, low foaming type
      Increase adhesion to polyimide of FPC boards
    • Surface Conditioner
    • Printed Wiring Board
  • OPC H-TEC CATALYST

    • Cause reduction reaction, metallize palladium ions
      Increase deposition performance and adhesion power of electroless copper plating
    • Catalyzing Agent
    • Printed Wiring Board
  • OPC H-TEC COPPER

    • Use for electroless copper plating by horizontal conveyance system
      Cyanide-free, rochelle salt based product
      Can show high deposition performance quickly
      High bath stability, not cause bristers on low surface roughness substrates
    • Electroless Copper Plating Solution
    • Printed Wiring Board