- For_Through-hole_Plating
- Electronics
- Printed Wiring Board
- Acid Copper Plating Additive
- Pick up:
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- For copper plating using phosphorus content copper anodes
High throwing power
Can use for high-aspect ratio printed wiring boards
- For Through-hole Plating
- Printed Wiring Board
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- For copper plating using insoluble iridium-oxide coating anodes
High throwing power
Can use for high-aspect ratio printed wiring boards
- For Through-hole Plating
- Printed Wiring Board
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- Via-filling additive developed also for through-hole plating
Same via-filling performance equal to TOP LUCINA HV can be obtained
- For Via-filling Plating
- Printed Wiring Board
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- Excellent in uniform deposition performance, deposits indicate very small stress
Applicable to various boards from FPC to high-aspect ratio boards
- For Through-hole Plating
- Printed Wiring Board
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- Additive for periodic reverse pulse electroplating
Can obtain bright appearances
Strongly improve macrothrowing power
- For Through-hole Plating
- Printed Wiring Board
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- Multi-purpose additive, easy bath control
- For Through-hole Plating
- Printed Wiring Board
