- For Through-hole Filling Plating
- Electronics
- Printed Wiring Board
- Acid Copper Plating Additive
- Pick up:
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- Via-filling additive developed also for through-hole plating
Same via-filling performance equal to TOP LUCINA HV can be obtained
- For Via-filling Plating
- Printed Wiring Board
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- By the combination with PR (periodic reverse) pulse electrolysis,
excellent filling power can be realized.
- For Through-hole Filling Plating
- Printed Wiring Board
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- Additive for through-hole filling, applicable to laser through holes
- For Through-hole Filling Plating
- Printed Wiring Board
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- Additive for through-hole filling, realize filling by direct DC plating with thin thickness
- For Through-hole Filling Plating
- Printed Wiring Board
