Use only for replenishing to increase chemical nickel concentration Can reduce drag-out amount just after replenishing Effective in terms of wastewater treatment and production costs
Excellent in bath stability for a long time use High-speed deposition, film brightness can be maintained Not easily damaded by scratched, prevent burnt deposition
Alkaline-type electroless nickel plating solution Can obtain high P content film (P content: 8 to 10%) High corrosion resistance Prevent nickel film dissolution aroung contact points Excellent in selective deposition performance Prevent the deposition to jigs Can decrease nickel concentration, economical product
Alkaline-type electroless copper plating solution Can obtain high P content film (P content: 8 to 10%) High corrosion resistance Prevent nickel film dissolution aroung contact points Excellent in selective deposition performance Prevent the deposition to jigs Can decrease nickel concentration, economical product
Alkaline-type electroless nickel plating solution Ammonia-free, excellent in corrosion resistance Prevent conductivity failure caused by no deposition on jigs Control electroplating film dissolution No need to increase the thickness of electroless nickel plating films (High P content, P content 8 to 10%)
