Copper paste for plating seed layer by screen printing Can use by low-temperature curing in air Excellent in deposition of electroless plating Achieve high adhesion between substrates and plating films
Catalyzing Agent
General plastics, Polyethylene terephthalate(PET), Polyimide(PI)
The OPC FLET process is an electroless copper plating process that is compatible with semi-additive methods. It has excellent uniform deposition on the material surface and inside via holes, reduces circuit width narrowing during flash etching, and also suppresses precipitation on copper, achieving crystal continuity between inner layer copper and upper layer plating copper. This process is ideal for forming fine patterns and micro via holes on IC substrates, suppressing the generation of voids.
Use after OPC-1200 EPOETCH step Strongly clean etched surface of epoxy resin Excellent in permeability to small holes and areas Not containing PFOS, PFOA, endocrine disrupting chemicals
Use with OPC-1200 EPOETCH, sodium permanganate based solution Can use for de-smear to clean inner copper foils Make concave and convex surfaces finely on epoxy resin
Selectively remove copper sputtering films Neutral type bath, prevent pattern width reduction Suppresse the increase in circuit surface roughness Control undercut Spray treatment is recommended
Stabilize catalyst adsorption in alkaline-ionic catalyzing step Give wettability, improve penetrating performance into small-diameter holes Control the amount of residues on copper High connection reliability with inner foils
High connecting reliability with inner copper foil and plated copper Can obtain copper film with small thickness stably Great deposition performance into via-, through-holes High adhesion power on low Ra materials, prevent blisters High purity copper is available Low sheet resistance is possible even by small thickness
Use for electroless plating, rochelle salt based Excellent in covering performance into via-holes Low residual stress Prevent blisters to low surface-roughness substrates
